By Elissa M. Bumiller,David A. Douthit,Joan Pecht
The textual content is split into 4 sections: Laminate production, Substrate Fabrication, revealed Wiring Board meeting, and Conformal Coatings. those sections speak about all features of illness of digital assemblies, from the manufacture of glass fibers utilized in the laminates to the entire meeting of the completed product. The authors current detection and keep watch over tools which may assist you lessen defects in the course of the production procedure. With tables, figures, and fishbone diagrams serving as a brief reference, infection of digital Assemblies can assist you become familiar with the origination, detection, dimension, keep watch over, and prevention of illness in digital assemblies.
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Extra info for Contamination of Electronic Assemblies (Electronic Packaging)
Contamination of Electronic Assemblies (Electronic Packaging) by Elissa M. Bumiller,David A. Douthit,Joan Pecht